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Thermstrate™ |
Thermstrate™ TC Thermstick™
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Thermstrate™ Thermal Solutions by
The Non-Dielectric Thermal Solution with Proven Performance
With thousands of applications under it’s belt, Thermstrate 2000 is a cost-effective viable solution for many heat dissipating applications. This proven thermal solution is pre-formed to your specification requirements This highly successful phase-change material has been proven in multiple independent test programs to provide low thermal impedance values for industrial OEM and military manufacturer applications. Thermstrate 2000 is available in a range of compound and substrate thicknesses to match surface finish and flatness conditions in the interface area. With regards to any thermal test, the best performance is gained by utilizing the thinnest material possible suitable for a given combination of flatness, finish, and applied mounting pressure. The thickness and pre-form flexibility of Thermstrate 2000 allows performance to be maximized along an interface with a variety of surface and flatness conditions. This ruggedized phase-change material is completely re-workable without the use of solvents and can be easily handled by both OEM assembly sites and heat sink manufacturers. The need for low-cost and high performance makes Thermstrate 2000 the optimal solution for any given heat dissipation application. Please feel free to contact us for samples of Thermstrate 2000. Test data is available upon request. Request Samples
The need for low-cost and high performance makes Thermstrate 2000 the optimal solution for any given heat dissipation application. Please feel free to contact us for samples of Thermstrate 2000. Test data is available upon request. Request Samples
The key to Thermstrate TC’s technology is it’s film-like deposition when applied to the interface surface. The thermal compound provides a low thermal resistance path allowing for efficient heat transfer. The Thermstrate TC applicator bar has been tested and approved in multi-phase assembly as well as electronic field repair. This low-cost solution has been accepted in high-volume PC applications due to it’s easy to apply and no mess design. The flexibility of applying Thermstrate TC makes it the proven solution for heat sinks, cold plates, and components, thus maximizing your design. Please feel free to contact us for samples of Thermstrate TC. Test data is available upon request. Request Samples
This sized down Thermstrate TC applicator bar has been developed to meet the needs of the retail market as well as manufacturer field repair requirements. Thermstick utilizes all technology benefits of Thermstrate TC technology. Thermstick is a low-cost solution used for quick and easy application of an interface where heat dissipation is required from component to heat-sink. Thermstick is the ideal solution for home or field service PC repair. Thermstick is a new application design recently released by Loctite and is shipped ready to use right out of the box. Please feel free to contact us for samples of Thermstick. Test data is available upon request. Request Samples
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