Powerfilm™ Thermal Solutions by

Solution #1: Powerfilm™ ~ Phase-Change Film Technology

High-Performance Pre-Formed Phase-Change Compound

• Pre-Applied to Device Case or Heat Sink
• Easy to Handle Pre-Formed Compound
• Low Thermal Impedance: .008 oC-in2/W
• Thixotropic Properties Prevents Run-Out
• No Adhesive Required
  

Powerfilm is an easy-to-use preformed compound film that is easily adapted to any manufacturing environment. Powerfilm has been tested and approved in a wide range of applications including industrial OEM, commercial, and military designs. Powerfilm is commonly available in a thickness of 3.3 mils, however, other thicknesses can be easily produced based upon customer requirements.

Popular applications for Powerfilm include Power Modules, DC-DC Converter Modules, IGBT’s, Solid State Relays, Diodes, SCR’s, Power MOSFets, RF Components, Thermo-Electric Modules, Microprocessors, Multichip Modules, ASIC’s, Power Supplies, and Power Amplifiers.

Powerfilm was developed as a high-performance solution to a variety of demanding electronic device thermal application requirements. Powerfilm is optimal when an ultra-thin layer of thermal compound with low thermal impedance values is necessary. Powerfilm allows for an even thickness of compound across an interface not found using hard-to-handle thermal greases.

The Powerfilm delivery system allows the thermal compound to be pre-applied to the heat sink application which is beneficial in a high-volume assembly environment. This efficient delivery system also allows Powerfilm to be easily automated during installation with the use of pick and place machinery.

This unique pre-formed compound film allows an engineer to maximize thermal performance at the same time reduce cost of installation. There is no messy clean required after installation or during re-work that are found when using thermal greases.

Powerfilm is available in clean sizable packs or on rolls for high-volume dispensing. Powerfilm’s easy-to-use format allows engineers the benefits of high-performance packaged with a clean installation. Please feel free to contact us for samples of Powerfilm. Test data is available upon request. Request Samples.

Solution #2: PowerfilmT TC™ ~ High Performance Applicator Bar

Powerfilm Performance in a Low-Cost Applicator

• Field Proven for Volume Production
• Thixotropic Properties Prevents Run-Out
• Utilizes Powerfilm Technology
• Easy-To-Use Applicator Bar
  

The success of Loctite’s Thermstrate TC applicator design has now been adapted to Powerfilm. Powerfilm TC is a unique high-performance thermal compound that undergoes a phase-change wetting action that fills gaps and voids along an interface surface.

Powerfilm TC prevents undesirable migration most commonly found using thermal greases. The Powerfilm TC applicator bar has been tested and approved in multi-phase assembly as well as electronic field repair. Due to the design of the easy-to-use applicator, Powerfilm TC has been adapted in high-volume applications where an easy-to-apply interface material is required.

Powerfilm TC utilizes the Powerfilm technology all consolidated in a small easy-to-use applicator. Powerfilm TC allows engineers to use the Powerfilm advantage at the same time receive the benefit of a low-installed cost.

Maximize your design with the use of Powerfilm TC. Please feel free to contact us for samples of Powerfilm TC. Test data is available upon request. Request Samples.

* Powerfilm™ is a registered trademark of Loctite, aHenkel Corporation